Case studies, qualification notes, and technical guides for copper additive manufacturing.
Additive Manufactured Copper Pin-Fin Heat Sink with CFD Validation Executive summary Pin-fin heat sinks fabricated by copper 3D printing (laser powder …
Read More →High-Density Copper Cooling Module for Compact Embedded Systems Executive summary Tight envelopes, rising heat flux, and fussy power budgets define …
Read More →LPBF Copper Heat Spreader Case Study for Electronics Packaging Executive summary This case study shows how a laser powder bed fusion (LPBF) copper …
Read More →Custom Copper Cooling Plate for Semiconductor Power Modules Semiconductor power modules—IGBTs, SiC MOSFETs, and rectifier stacks—push serious watts …
Read More →3D Printed Copper Heat Sink for High-Power Electronics Cooling Why copper + LPBF is a big deal for thermal management When your electronics run hot, …
Read More →Turn critical designs into production-ready copper parts with LPBF & DMLS—conductive, consistent, and well-documented.